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TÜTEL Organizes Chip Design Competition!

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TÜTEL (Integrated Circuit Design and Training Laboratory) is organising a Chip Design Competition within the scope of TEKNOFEST Technology competitions. This competition aims to develop the skills of students interested in micro-electronic technologies.

The Chip Design Competition will be held under two categories: Digital Design and Analog Design. Undergraduate and graduate students will be able to participate individually or in teams of up to four people.

In the Chip Design Competition, it is of great importance for teams to showcase their chip design skills. Competitors are expected to prepare both a Preliminary Design Report and a Detailed Design Report. They are also expected to conduct a project demo where they will show their projects live and make a final presentation. In the first stage of the competition, the Preliminary Design Reports of the teams will be evaluated and the selected competitors will be determined as a result of the pre-selection. In the second stage, the Detailed Design Reports submitted by the teams will be evaluated and the teams that are eligible to participate in the competition will be determined.

Apart from the information given in the specification, for other questions you want to ask about the competition, you must be a member of the relevant mail group from the Chip Design Contest Group link: Çip Tasarım Yarışması Grubu  The questions you will ask and the answers to these questions will be open for other members of the mailing group to see.

For detailed information and application, please visit TEKNOFEST and Chip Design Competition web pages. Don't miss this great opportunity! We wish you success!

The deadline for applications is March 14th!

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TÜTEL Organizes Chip Design Competition!

TÜTEL (Integrated Circuit Design and Training Laboratory) is organising a Chip Design Competition within the scope of TEKNOFEST Technology competitions. This competition aims to develop the skills of students interested in micro-electronic technologies.

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